Study on Thermal Conductivity and Mechanical Properties of Cyclotriphosphazene Resin-Forced Epoxy Resin Composites

Cyclotriphosphazenes, a variety of inorganic rings together with curing ingredient, 4,4′-methylene dianiline (MDA), are mainly used to enhance the thermal conductivity and mechanical characteristics epoxy resin (DGEBA). Three DGEBA@MDA, HGCP@MDA, thermosets were produced, their behaviors investigated. Using molecular dynamics (MD) approach, impact cyclotriphosphazene on DGEBA composites is thoroughly explored in this paper. Results indicated that glass transition temperatures (Tg) containing HGCP had slightly decreased compared DGEBA. With addition DGEBA, (DGEBA@HGCP@MDA) has high 0.215284 W/m·K, an increase 116.04% more than pure (0.185524 W/m·K). Moreover, DGEBA@HGCP@MDA composite strength specific Young’s modulus 5.4902 GPa. In order forecast analyze certain performances directly associated microstructure various cross-linked systems materials, MD simulation approach will be quite valuable.